Prevention of Running Blots between the Patterns during the Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finish 


Vol. 19,  No. 2, pp. 84-89, Jun.  2013


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  Abstract

The running blots between patterns during electroless nickel electroless palladium immersion gold (ENEPIG) surface finish of printed circuit board (PCB) are investigated and a proper solution is presented. Computational chemistry is first employed to understand the process and experiments are then designed to verify the proposed ideas. A PdCl2 activator which has relatively weak chemical bonding to the epoxy resin is introduced to prevent the formation of palladium seeds on the epoxy resin and a couple of operational measures such as increasing HCl concentration and lowering the temperature of Pd activation process are executed to prevent a further hydrolysis of PdCl2 to more stable Pd(OH)2 in aqueous solution. Computational chemistry provides thermodynamic backgrounds for experiments and their results. This combined approach is expected to be very useful in the research of relevant processes.

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  Cite this article

[IEEE Style]

E. KH, S. JW, W. YS, "Prevention of Running Blots between the Patterns during the Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finish," Clean Technology, vol. 19, no. 2, pp. 84-89, 2013. DOI: .

[ACM Style]

Eom KH, Seo JW, and Won YS. 2013. Prevention of Running Blots between the Patterns during the Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finish. Clean Technology, 19, 2, (2013), 84-89. DOI: .

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