Numerical Analysis of Heat Transfer of Aligned Wing Type Pin-Fin Array of Air Cooling Module with Various Fin Shapes for Electronic Packaging Application 


Vol. 14,  No. 4, pp. 265-270, Dec.  2008


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  Abstract

In this study, the flow and heat transfer of the aligned pin-fin array of the air cooling module for electronic packaging application were numerically analyzed with various fin shapes. The geometric cross-sectional shapes of pin-fins considered in this study were ellipse, wing and circle. The fins had same cross-sectional area and height, but they had different surface areas. As the results, the surface area, the heat transfer coefficient, and the heat transfer performance of pin-fins greatly depended on their shapes. Of the three types of pin-fins, the wing type pin-fin with suitable shape produced the best heat transfer performance. This result implies that the cooling capacity of the pin-fin cooler can be significantly enhanced only by the change of fin shape without increasing air flow-rate or fin density.

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  Cite this article

[IEEE Style]

K. SY, H. K, S. SW, "Numerical Analysis of Heat Transfer of Aligned Wing Type Pin-Fin Array of Air Cooling Module with Various Fin Shapes for Electronic Packaging Application," Clean Technology, vol. 14, no. 4, pp. 265-270, 2008. DOI: .

[ACM Style]

Kim SY, Heo K, and Shin SW. 2008. Numerical Analysis of Heat Transfer of Aligned Wing Type Pin-Fin Array of Air Cooling Module with Various Fin Shapes for Electronic Packaging Application. Clean Technology, 14, 4, (2008), 265-270. DOI: .

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