Improvement of the Surface Roughness of a 3D Stereolithographic Part for a Molded Interconnect Device
Vol. 30, No. 3, pp. 211-219, Sep. 2024
10.7464/ksct.2024.30.3.211
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Additive manufacturing 3D Printing Direct cure Direct printing Surface roughness Area error UV intensity Pattern spacing 보 문
Abstract
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Cite this article
[IEEE Style]
J. B. Ko, H. B. Kim, Y. J. Yang, "Improvement of the Surface Roughness of a 3D Stereolithographic Part for a Molded Interconnect Device," Clean Technology, vol. 30, no. 3, pp. 211-219, 2024. DOI: 10.7464/ksct.2024.30.3.211.
[ACM Style]
Jeong Beom Ko, Hyeon Beom Kim, and Young Jin Yang. 2024. Improvement of the Surface Roughness of a 3D Stereolithographic Part for a Molded Interconnect Device. Clean Technology, 30, 3, (2024), 211-219. DOI: 10.7464/ksct.2024.30.3.211.