Improvement of the Throwing Power (TP) and Thickness Uniformity in the Electroless Copper Plating 


Vol. 17,  No. 2, pp. 103-109, Jun.  2011


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  Abstract

The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.

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  Cite this article

[IEEE Style]

S. J, L. J, W. YS, "Improvement of the Throwing Power (TP) and Thickness Uniformity in the Electroless Copper Plating," Clean Technology, vol. 17, no. 2, pp. 103-109, 2011. DOI: .

[ACM Style]

Seo J, Lee J, and Won YS. 2011. Improvement of the Throwing Power (TP) and Thickness Uniformity in the Electroless Copper Plating. Clean Technology, 17, 2, (2011), 103-109. DOI: .

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