Wet Chemical Process for Improving Air Quality in Semiconductor Manufacturing Process 


Vol. 13,  No. 2, pp. 109-114, Jun.  2007


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  Abstract

In this study, we performed basic researches to develop wet purification system improving air qualities of ventilation in semiconductor manufacturing process. Using 0.5 M aqueous solution of KMnO4, 50ppm of NH3, SOx and NOx were reduced to 99% successfully. However, the removal of O3 was limited to 22~30% for all the tested chemical solutionsincluding KMnO4. Therefore, adoption of a dry ozone filter is necessary to reduce O3 below a satisfactory level. For all the chemical solutions tested, NOx removal efficiency increased as NOx was mixed with O3. As chemical solution was sprayed using water spraying system equipped with air atomizing type nozzle, the removal efficiencies of gaseous pollutants increased due to the increase of gas-liquid interfacial area.

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  Cite this article

[IEEE Style]

J. CS, K. HJ, P. YM, L. DW, J. SM, H. DS, L. KY, "Wet Chemical Process for Improving Air Quality in Semiconductor Manufacturing Process," Clean Technology, vol. 13, no. 2, pp. 109-114, 2007. DOI: .

[ACM Style]

Jun CS, Kim HJ, Park YM, Lee DW, Jeon SM, Ham DS, and Lee KY. 2007. Wet Chemical Process for Improving Air Quality in Semiconductor Manufacturing Process. Clean Technology, 13, 2, (2007), 109-114. DOI: .

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pISSN : 1598 - 9712
eISSN : 2288 - 0690

한국연구재단 등재학술지